- A Fatigue-resistant Lead-free Candidate: the Sn/Ag/Cu/In System
by Dr Jennie S. Hwang
SMT Magazine Oct 2000

- Part 1: Lead-free Implementation - Two Approaches
by Dr Jennie S. Hwang
SMT Magazine Nov 2003

- Part 2: Lead-free Implementation Alloys - Two Approaches
by Dr Jennie S. Hwang
SMT Magazine Dec 2003

- Part 3: Lead-free Implementation: No Need for Higher Temperature
by Dr Jennie S. Hwang
SMT Magazine Jan 2004

- Part 4: Lead-free Implementation: Critical Production Considerations
by Dr Jennie S. Hwang
SMT Magazine Mar 2004

- Step 3: Solder Materials
by Dr Jennie S. Hwang
SMT Magazine Mar 2004

- Comparative Wetting Ability of Lead Free Alloys
by Kai Hwa Chew, Vincent Kho and Dr Jennie S. Hwang
EP&P Magazine Jan 2003

- Drop in Replacement of Tin/lead Solder Alloy in Wave Soldering Process
by K.H. Chew

- Dr Jennie S. Hwang OnBoard Interview
by Divo Mari
OnBoard Technology Nov 2005

- Impact of Drop-in Lead Free Solders on Microelectronics Packaging
by K.H. Chew