SCS, an enhanced tin/copper lead free alloy, is highly recommended to directly replace existing SnCu0.7 or SAC solder in different soldering applications [US Patent: 7,472,817; WO 2006/045995 A1; Japanese Patent: 4,048,288].  This alloy not only exhibits the excellent ductility of SnCu0.7 solder, it possesses superior mechanical strength both in ambient and high temperature environments.  SCS’s fatigue resistance is now comparable to tin/lead solder and as such, SCS has addressed the fundamental concerns of tin/copper alloys.  Its applications cover wave soldering, SMT, HASL, dipping processes, manual/auto soldering and solder joints touch up using solder wires.  This cost effective alloy has been designed to meet the most stringent requirements of the electronics industries.

SCS7: Sn/Cu0.7/Si0.02                 Melting Temperature = 227 °C
SCSI73: Sn/Cu0.7/Si0.02/In3.0    Melting Temperature = 219-221°C

Why SCS…

  • Solution for cost effectiveness and high reliability
  • Solved the fundamental problem of SnCu0.7 alloy
  • Good mechanical properties even with ageing
  • Good thermal fatigue resistance
  • Excellent solderability and compatible with various surface finishes
  • Low solder pot leaching tendency
  • Low copper dissolution rate
  • Excellent plated-through-hole fill
  • Low drossing

( View in PDF Format )

Creep Resistance
Joint Strength
Material Properties Data
Thermal Shock Test
Temperature Ageing Test
Solder Joint Appearance