VIROMET SERIES

Singapore Asahi is proud to present our low temperature lead free solder materials – Viromet alloy [US Patent: 5,985,212; 6,176,947; 6,843,862 World Patent: WO 03/006200 A1]. This alloy is enhanced SnAgCu alloy with addition of Indium.

Viromet 347: Sn/Ag4.1/Cu0.5/In7.0     Melting Temperature: 202-207 °C
Viromet 349: Sn/Ag4.1/Cu0.5/In4.0     Melting Temperature: 205-210 °C
Viromet 302: Sn/Ag3.0/Cu0.5/In2.5     Melting Temperature: 210-212 °C

Due to the higher reliability and lower operating temperature, Viromet series of alloys are recommended as Drop-in Replacement for conventional SnPb alloy and also as a solution for all lead free applications in consumer, medical, automotive, military, industrial, telecommunication etc. In comparison to SnPb and other lead free solders such as SAC, Viromet Pb-free solder exhibits the following characteristics:

Cost Effectiveness

• Low working temperature of 245 °C, hence less electricity consumption
• No or minimum alteration of existing machines or equipment required
• No change in components and PCB boards required
• Applicable under normal air conditioned enclosures without the need for N₂ environment
• Low drossing

Ease of Implementation

• Drop-in replacement for SnPb alloy
• Low operating temperature
• Minimal or no change to existing SnPb process   

                                                           
High Reliability

• Excellent physical and mechanical properties
• Superior wettability even at low working temperature
• Compatible with wide range of substrates: Sn, Ni/Au, Ag, OSP etc
• No lifting of solder joints is observed for plated-through-hole applications