SCS SERIES VIROMET SERIES

VIROMET SERIES


Q1.    Indium (Source, Supply, Applications, Recycling)

A1.    Produced mainly from ores of Zn, also found in ores of Cu, Fe and Pb ores.

  • Sources (1999~2000):  China (46%), Canada (27%), France (8%),
    Russia (7%), Others (12%)
  • 3 times more abundant than Ag & Mercury – U.S. Geological Survey,
    Mineral Commodity Summaries, January 2004.
  • When demand increases, supply will also increases.
  • Indium price dropped to USD120/Kg in 2000, hence, no motivation for
    recycling.  With increase in Indium price, there is a higher resources
    channeled towards Indium recycling.

Q2.     Why Viromet?

A2.     Asahi offers alternative solution, which is the drop-in approach,

  • No change in process
  • No change in equipment
  • No board change needed
  • No added process cost
  • No more worry on heat sensitive components
  • Proven reliability in harsh environment electronic
  • Proven manufacturability
  • Excellent wetting even at low temperature
  • Minimal or no voids
  • No Nitrogen environment needed
  • Compatible with :Sn, AuNi, Ag, OSP etc
  • Available in full range products : Bar, Paste, Wire, Spheres.

Q3.     No heat sensitive components, PCB – no need for low temperature alloys.
          Suppliers have already rectified the problems.

A3:     Under perfected conditions, PCB, components coupled with idealized production
          process to suit specifically for high temperature alloys, there is no necessity to use
          low temperature alloys.  However, perfect conditions may sometimes be over
          idealized as problem occurrence may not be easily detected by existing reliability
          test methodologies as they are tailored made for the leaded solder.  There will
          always be this possible uncertainty which may not be apparent at the moment, and
          will only surface with high volume production or long period of time before
          failure.  In all experiments, varying too many factors at one time will only result
          in confusion during analysis when a problem occurs.  It is always advisable to
          vary one factor at a time – which in this case, is the alloy used for the interconnects.

Q4.      Low End Products – Solder too expensive

A4:     For low products are low end short product life is expected and cost is one of the
           major concern, then, cheaper lead free solders such as our new SCS7 can be used. 
           However, this solder has lower creep properties, and low cycle fatigue in
           comparison with our Viromet but is comparable to SnPb and SnCu alloys.

Q5.      Viromet as a Transitional Alloy?

A5.     At this moment, the lead free market is still not stable, a highly reliable drop in alloy such as the
          Viromet solder may contribute significantly to the progress of conversion.  Currently, Viromet
          provides the full solution to lead free implementation.

Q6.     What do the terms RoHS and lead-free mean?

A6.     RoHS is the acronym for the European Union Directive 2002/95/EC "Restriction
           of Hazardous Substances". This directive states that on June 1, 2006 all electronic
           equipment sold in the EU will have no more than trace amounts of lead, cadmium,
           chromium VI, mercury, and PBB/PBDEs; substances associated with
           environmental and health risks. Lead-free is a movement in the United States to
           remove lead from the production of electronics. All RoHS certified products are
           also considered lead-free.

Q7.      Where are these substances used in switches and what are the limits?

A7.      Lead (Pb)

Found in terminals, solder, and plating, but is a very abundant element in the environment and can be found in trace amounts in almost every "pure" material. The limit set on this is substance 700ppm (0.07% by weight).
Cadmium (Cd):  
Used in contact pads of switches to reduce arcing, but is not common.
The limit set on this substance is 100ppm (0.01% by weight).
Chromium VI (Cr+6):  
Can be found in platings to prevent corrosion. However, it is not common. The limit set on this substance is 1,000ppm (0.1% by weight).
Mercury (Hg):
Is not used in Lamb switches. The limit set on this substance is 1,000ppm (0.1% by weight).
PBB/PBDEs:     
Polybrominated biphenyl (PBB) and polybrominated diphenyl ethers (PBDE) are used as flame-retardants in some plastics. The limit set on this substance is 1,000ppm (0.1% by weight).

Q8.      Any application manual available for Viromet products?

A8.      Yes.  Please refer to section called User Manual or call our marketing office for 
            more information.

Q9.     Voiding in BGA joints

A9:      Conventional methods of investigating voids is through X Ray analysis, however,
            Pb has high X-Ray absorption, which may mask the real problem with voids for
            the SnPb solder.  Hence, the best way to gauge voids is through cross sectioning. 
            Voids are usually present, some are big and some are small.  Solder joints are
            more tolerant towards smaller voids than larger voids.  In fact, smaller voids result in better joint integrity through crack impediment.
            IPC-A-610C (acceptability of electronic assemblies)

  • Maximum acceptable percentage of the ball-to-board interface area covered by voids should not exceed 10%.
  • > 25% voiding are classified defect.

IPC-7095 (design and assembly process implementation for BGAs)

  • Range of 9% to 36% depending on the vertical position of the voids and on the application of the assembly.
    As for the role as a solder supplier, our R&D is in the process of studying how to
    solve the problem from the chemical formulation.

Q10:    Perfected Machine/ Equipment, no need for low temperature alloy.

A10:     Better equipment is always encouraged if the company has budgeted for the
            increase in cost for all the lines in the production lines.  Existing equipment may
            not have served its full service life potential, waste to throw away functional
            equipment.  However, a better equipment with a better product will improve the
            overall quality of the product.

Q11:   Asahi is the only source of Viromet solders, will a monopoly situation occur?
           What about supply?

A11:    Our business centers around customer satisfaction and that is the only key to our survival. 
           Currently, our market size is still small, hence, production is not an
           issue. We have already geared ourselves for large volume production, which is currently at the planning stage. 
           Monopoly is already in existence for the SAC and SnCuNi market.  However, the
           market competition will always be the guiding force in price setting other than
           supply and demand.  This will be true for Viromet solders too.

Q12:  Any modifications to the wave solder pot required?

A12:  Old equipment can be used.  However, pot surface and parts’ surface treatment is
          necessary to prevent corrosion.  As with other Lead Free solder, higher amount of
          Tin is used in the solder, which may result in dissolution of corrosion resistant
          materials in the solder pot e.g. Cr, Ni.  Hence, surface treatment is required.
          However, our alloy can be used at 245 ~ 250oC, which is similar to present process
          temp., hence, as compared to alloys that are used with higher process temperature,
          the corrosion effect could be less